Product Name: Beryllium oxide ceramic copper-clad substrate - Ceramic PCB - Beryllium oxide ceramic immersion gold

Material: Be0: 99.5%, Al203: 0.18%, Si02: 0.13%, others: 0.19%

Product model: YCB-TC-FT 2026050802

Thermal conductivity: 310W/m · K, dielectric constant: 6.9 (at 1MHz)

Thermal expansion coefficient: 9.2 × 10-6/° C

Density: 3.05g/cm3

Pressure free sintering temperature: 1750 ℃

Hardness:>HRA86 Compression strength:>350Mpa

Volume resistance:>1014

Dielectric breakdown strength: 25kV/mm Flatness:<0.035

Thickness: 0.55mm Metalization material: TiPtAu

Titanium layer thickness: 0.3 microns, lead layer thickness: 0.5 microns, gold layer thickness: 0.1 microns

Packaging size: 6.7*13.4*1.3cm

Weight: 10 grams

Energy saving: The thermal resistance of the substrate is extremely low, the electric thermal conversion
efficiency is high, and the ineffective heat loss is greatly reduced. Under the same heating and cooling
effects,energy consumption is lower,and long-term operation can significantly reduce equipment electricity
costs.
Thermal conductivity: The heat conduction speed is extremely fast, which can quickly export the working
heat of the device,quickly reduce the working temperature,and avoid high temperature aging and overheating
failure.
Uniformity: The copper layer of the grid is uniformly distributed throughout the entire area,with no local
hot spots for heating and cooling. The temperature difference between the board surfaces is small, and the
temperature control accuracy is higher, ensuring stable and consistent operation of the device in all areas.
Insulation: Ceramic substrate has high insulation strength, high voltage breakdown resistance, and can
completely isolate live circuits from external metal structures, eliminating the risks of leakage, short
circuit, and ignition. It is safe and reliable to use.
Stability: resistant to high temperature, cold and hot shock, able to withstand extreme high and low
temperature cycles, long-term high temperature operation without cracking or deformation, material
performance does not deteriorate, and the working state is long-lasting and stable.
Reliability: The metal copper layer is tightly and firmly bonded to the ceramic, and does not detach, peel,
or solder off during long-term high current operation. The overall structural strength is high, and it is
resistant to vibration and not easily damaged, with a longer service life.
Adaptability: Stable chemical performance, acid and alkali resistance, corrosion resistance, salt spray
resistance, and moisture resistance. It can serve stably for a long time in harsh and complex environments
such as industry, military, aerospace, etc.
Mechanical properties: Ceramic substrates have high mechanical strength, excellent impact and vibration
resistance, and can stably adapt to harsh working conditions such as high vibration and high impact in
vehicles and industrial control.