Product Name: Aluminum oxide multi unit ceramic copper-clad substrate - ceramic DBC - oxygen free copper foil

Material: Al2O3: 99.99%, SiO2: 0.6%, SrCO3: 0.3%, others: 0.1%

Product model: YCB-TC-FT 2026050808

Thermal conductivity: 53W/m · K, dielectric constant: 13.2TC

Thermal expansion coefficient: 6.2 × 10-6/° C

Density: 4.15g/cm3

Pressure free sintering temperature: 830 ℃

Hardness:>HRA86 Compression strength:>350Mpa

Volume resistance:>1014

Dielectric breakdown strength: 25kV/mm Flatness:<0.035

Thickness: 2.05mm  Metalization Material: TiCu Metalization

Titanium layer thickness: 0.3 microns  Copper layer thickness: 0.5 microns

Packaging size: 8.5 * 17 * 1cm

Weight: 75 grams

 Thermal compatibility: The thermal expansion coefficient of ceramic substrate is highly matched with that
of semiconductor silicon chip, which can reduce the risk of welding stress and deformation failure caused
by high and low temperature cycles, and is suitable for wide temperature range working scenarios.
Mechanical reliability: Ceramic substrates have strong rigidity and excellent resistance to deformation.
When combined with metalized vias and copper-clad reinforcement structures, they can withstand harsh
working conditions such as vibration and impact, ensuring stable operation of circuits in complex
environments.
Thermal conductivity: The heat conduction speed is extremely fast, which can quickly export the working
heat of the device,quickly reduce the working temperature,and avoid high temperature aging and overheating
failure.
Structural adaptability: Standardized pad layout and large-sized current carrying copper foil design can
directly adapt to multi chip parallel power module packaging, simplifying the device assembly process.
Insulation: Ceramic substrate has high insulation strength, high voltage breakdown resistance, and can
completely isolate live circuits from external metal structures, eliminating the risks of leakage, short
circuit, and ignition. It is safe and reliable to use.
Stability: resistant to high temperature, cold and hot shock, able to withstand extreme high and low
temperature cycles, long-term high temperature operation without cracking or deformation, material
performance does not deteriorate, and the working state is long-lasting and stable.
Process adaptability: The copper layer has excellent solderability and bonding performance, compatible
with various packaging processes such as SMT mounting, eutectic soldering, and wire bonding, and is
suitable for high-density integration and assembly of various components.
Adaptability: Stable chemical performance, acid and alkali resistance, corrosion resistance, salt spray
resistance, and moisture resistance. It can serve stably for a long time in harsh and complex environments
such as industry, military, aerospace, etc.
Mechanical properties: Ceramic substrates have high mechanical strength, excellent impact and vibration
resistance, and can stably adapt to harsh working conditions such as high vibration and high impact in
vehicles and industrial control.