Product Name: Optoelectronic/laser light source dedicated ceramic substrate - ceramic DBC - gold-plated copper foil

Material: Al2O3: 99.99%, SiO2: 0.6%, SrCO3: 0.3%, others: 0.1%

Product model: YCB-TC-FT 2026050805

Thermal conductivity: 53W/m · K, dielectric constant: 13.2TC

Thermal expansion coefficient: 6.2 × 10-6/° C

Density: 4.15g/cm3

Pressure free sintering temperature: 1880 ℃

Hardness:>HRA86 Compression strength:>350Mpa

Volume resistance:>1014

Dielectric breakdown strength: 25kV/mm Flatness:<0.035

Thickness: 1.1mm Metalization material: TiPtAu

Titanium layer thickness: 0.3 microns  Lead layer thickness: 0.5 microns  Gold layer thickness: 0.1 microns

Packaging size: 7.7*15.4*1cm

Weight: 4 grams

Energy saving: The thermal resistance of the substrate is extremely low, the electric thermal conversion
efficiency is high, and the ineffective heat loss is greatly reduced. Under the same heating and cooling
effects,energy consumption is lower,and long-term operation can significantly reduce equipment electricity
costs.
Thermal conductivity: The heat conduction speed is extremely fast, which can quickly export the working
heat of the device,quickly reduce the working temperature,and avoid high temperature aging and overheating
failure.
Integration:Multi channel integrated wiring can integrate multiple sets of optoelectronic units on a single
substrate, greatly reducing the size of the light source module and assisting in the miniaturization design
of equipment.           
Insulation: Ceramic substrate has high insulation strength, high voltage breakdown resistance, and can
completely isolate live circuits from external metal structures, eliminating the risks of leakage, short
circuit, and ignition. It is safe and reliable to use.
Stability: resistant to high temperature, cold and hot shock, able to withstand extreme high and low
temperature cycles, long-term high temperature operation without cracking or deformation, material
performance does not deteriorate, and the working state is long-lasting and stable.
Craftsmanship: The copper foil surface has high flatness and excellent weldability, making it easy for
subsequent chip mounting, soldering, and other processing operations, reducing the difficulty and defect
rate of the production process.           
Adaptability: Stable chemical performance, acid and alkali resistance, corrosion resistance, salt spray
resistance, and moisture resistance. It can serve stably for a long time in harsh and complex environments
such as industry, military, aerospace, etc.
Mechanical properties: Ceramic substrates have high mechanical strength, excellent impact and vibration
resistance, and can stably adapt to harsh working conditions such as high vibration and high impact in
vehicles and industrial control.           
Load bearing capacity: Gold plated copper foil has excellent conductivity and strong high current carrying
capacity, which can stably meet the power supply needs of high-power optoelectronic chips without the risk
of overheating and melting of the circuit.